Product description

Izovac Beam Cleaning System is designed to ensure accurate removal of low molecular weight materials (LMWM), like absorbed gases, water, and organic fragments from the substrate, and facilitates activation of the surface molecular and atom bonds of the processed surface. The cleaning process is performed in the vacuum chamber prior to the deposition process and guarantees excellent adhesion of the first deposited layer to the surface of the substrate.

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Key features and advantages

Izovac Beam Cleaning System

• Operation with noble gases (Ar), active gases (O₂, N₂, CF_x, C_xH_y etc.) and their mixtures;
• Cleaning process is performed with uniformity of not worse than ± 5% on the substrate with maximum length up to 3200 mm;
• Reliable continuous operation;
• Simple and reliable installation in the in in-line or batch type vacuum equipment;
• Opportunity to clean the substrate at different angles (10°-90°);
• High speed of cleaning;
• Guaranteed adhesion without special sub-layers;
• Various types of the substrates (metals, semiconductors, dielectrics, polymers).

Application

Izovac Beam Cleaning System offers accurate and effective surface preparation for:

• Large area coating for FPD production
• Large area coating for architectural glass
• Microelectronic silicon chip manufacturing
• Optics and lasers
• Optoelectronics and telecommunications.

Technical data

Source type: closed drift accelerator with anode layer.
Working gases: Ar, N₂, H₂, O₂, CH, CO, CF, NH, air etc.
Ion energy: 400 eV - 2500 eV.
Linear density of the discharge current: 5-6 mA/cm of slit length.
Ion beam current (average): 1,0-1,3 of discharge current, depending on working gas
Maximum anode voltage: 5,0 kV.
Maximum operating pressure: (1,2-1,3)x10-1 Pa
Minimum operating pressure: 5,0x10-2 Pa
Typical operating pressure: (8-9)x10-2 Pa
Ion source length: 140-3200 mm

Please contact Izovac for more information on the configuration options and quote request:

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