PECVD

PECVD technology – Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process by which thin films of various materials can be deposited on substrates at lower temperature than that of standard Chemical Vapor Deposition (CVD).

Key advantages of IZOVAC's   PECVD technology :

• High yield, due to:

1. Fine  film thickness uniformity
2. Minimizing film contamination - Particles free
3. The ability to control the internal film stress in the layers (it's possible to get "0"-stresses)

• High uptime - >90 %
• The lowest cost of consumables coupled with high material utilization rate
• High deposition rate

PECVD technique, developed by Izovac, allows achieving AR coating with the following characteristics:

• — Flatness: Warp-free film averaging 0.035 mm
• — Thickness uniformity: < ± 1,5%
• — Index uniformity: < ±0.5%
• — Transmission uniformity: < ±1.5%
• — Transmission : > 90% from 400~700nm
• — Reflection:
  a. R_Avg(400~700nm)≦1.0%
  b. R_Max(400~700nm)≦1.5% (it could be changed due to the customer color requirement)     
• — Low absorption

AR coatings deposition could be combined with AF coating deposition in one cycle (AR+AF coating).