PECVD
PECVD technology – Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process by which thin films of various materials can be deposited on substrates at lower temperature than that of standard Chemical Vapor Deposition (CVD).
Key advantages of IZOVAC's PECVD technology :
- High yield, due to:
- Fine film thickness uniformity
- Minimizing film contamination - Particles free
- The ability to control the internal film stress in the layers (it's possible to get "0"-stresses)
- High uptime - >90 %
- The lowest cost of consumables coupled with high material utilization rate
- High deposition rate
PECVD technique, developed by Izovac, allows achieving AR coating with the following characteristics:
- Flatness: Warp-free film averaging 0.035 mm
- Thickness uniformity: < ± 1,5%
- Index uniformity: < ±0.5%
- Transmission uniformity: < ±1.5%
- Transmission : > 90% from 400~700nm
- Reflection:
a. RAvg(400~700nm)≦1.0%
b. RMax(400~700nm)≦1.5% (it could be changed due to the customer color requirement) - Low absorption
AR coatings deposition could be combined with AF coating deposition in one cycle (AR+AF coating).